Chinese smartphone giant Huawei, which has been under heavy attack from the U.S. government the last few months, just revealed its next-generation smartphone system-on-a-chip (SoC) product "Kirin 990 5G," signaling the company's business is not stalled by foreign strangling.
The launch event was held simultaneously, at IFA electronic show in Berlin, Germany, and in Beijing on Friday.
In his keynote speech, Huawei's head of gadgets Yu Chengdong told the press that the chip is more advanced than other flagship smartphone SoCs, because it has a built-in 5G modem.
Current rivals of the chip have no 5G modem and have to rely on an extra chip to support 5G.
"The Kirin 990 is not only an SoC and a 5G modem glued together. We put a lot of effort in integrating the two chips. So the new chip use less power and generate less heat while getting the job done," said Huawei fellow Ai Wei before the launch event.
The chip also features two AI cores, a big and a small one. This design saves battery power by only using the small core to process simple AI tasks and only resort to the big core when works get harder.
The chip is so dense that it contains 10.3 billion semi-conductors, the first and largest of its kind.
The chip will be used on Huawei's next flagship smartphone, the Mate 30, enabling the device to shoot 4K videos (4,000 pixels) at 60 frames per second.
There is no flagship smartphone that can shoot at the same quality on the mainstream market.
